Mechanical Die-Level Packaging Engineer
Odon, IN 
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Job Description
Mechanical Die-Level Packaging Engineer
Job Location US-IN-Odon
Requisition ID 2022-6335
Overview

Draper is an independent, nonprofit research and development company headquartered in Cambridge, MA. The 1,800 employees of Draper tackle important national challenges with a promise of delivering successful and usable solutions. From military defense and space exploration to biomedical engineering, lives often depend on the solutions we provide. Our multidisciplinary teams of engineers and scientists work in a collaborative environment that inspires the cross-fertilization of ideas necessary for true innovation. For more information about Draper, visit www.draper.com.

Our work is very important to us, but so is our life outside of work. Draper supports many programs to improve work-life balance including workplace flexibility, employee clubs ranging from photography to yoga, health and finance workshops, off site social events and discounts to local museums and cultural activities. If this specific job opportunity and the chance to work at a nationally renowned R&D innovation company appeals to you, apply now www.draper.com/careers.

Equal Employment Opportunity

Draper is committed to creating a diverse environment and is proud to be an affirmative action and equal opportunity employer. We understand the value of diversity and its impact on a high-performance culture. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, disability, age, sexual orientation, gender identity, national origin, veteran status, or genetic information.

Draper is committed to providing access, equal opportunity and reasonable accommodation for individuals with disabilities in employment, its services, programs, and activities. To request reasonable accommodation, please contact hr@draper.com.

Responsibilities

Draper is seeking a mechanical engineer for a role focused on electronics packaging. Specific responsibilities include:

    Perform mechanical design and development associated with the physical arrangement of electronic circuits including assembly design, analysis, build, test, and documentation support
  • Develop die-level packaging solutions including proposing solutions for placement and control of sensing components requiring precise alignment to be maintained through shock, vibration, and thermal disturbances
  • Contribute to solving complex, customer-driven problems as part of a multi-disciplinary team, advance designs when requirements are unclear or incomplete, and adapt appropriately to changes in requirements
  • Communicate effectively and openly with a multi-disciplinary program team members and program leadership, including non-technical personnel
  • Define an approach to independently solve technical problems and execute assignments with minimal oversight while maintaining program schedule and budget
  • Provide work instructions to support staff and guide junior staff
  • Identify technical and schedule risks associated with a design decision and communicate them to project leadership
  • Strong organization, planning and time management skills to achieve program goals
Qualifications

Qualifications:

Required Qualifications:

  • Bachelor of Science degree with 2+ years of experience in a relevant field such as mechanical engineering, materials science, or manufacturing engineering
  • Master of Science degree in a relevant field such as mechanical engineering, materials science, or manufacturing engineering
  • Team player able to work in a fast-paced environment with demonstrated ability to handle multiple competing tasks and demands
  • Experience designing in 3D CAD using SolidWorks and/or CREO

Preferred Qualifications:

  • Experience with analysis tools such as ANSYS, COMSOL, and/or MatLab
  • Familiarity with materials, fabrication, and assembly techniques associated with printed circuit assemblies including surface mount technology, high density substrates, rigid-flex designs, and integrated circuit assembly
  • Familiarity designing/directing the physical layout of electrical circuits including SMD, interconnect definition, and integrated circuit assembly techniques
  • Familiarity with machine shop tools and processes, prototyping, and vendor coordination

Security Clearance:

Applicants selected for this position will be required to obtain and maintain a U.S. Government security clearance.

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Job Summary
Company
Start Date
As soon as possible
Employment Term and Type
Regular, Full Time
Required Education
Bachelor's Degree
Required Experience
2+ years
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