Senior High Density Die Level Electronics Packaging Engineer
Odon, IN 
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Posted 20 days ago
Job Description
Senior High Density Die Level Electronics Packaging Engineer
Job Location US-IN-Odon
Requisition ID 2022-6318
Overview

Draper is an independent, nonprofit research and development company headquartered in Cambridge, MA. The 1,800 employees of Draper tackle important national challenges with a promise of delivering successful and usable solutions. From military defense and space exploration to biomedical engineering, lives often depend on the solutions we provide. Our multidisciplinary teams of engineers and scientists work in a collaborative environment that inspires the cross-fertilization of ideas necessary for true innovation. For more information about Draper, visit www.draper.com.

Our work is very important to us, but so is our life outside of work. Draper supports many programs to improve work-life balance including workplace flexibility, employee clubs ranging from photography to yoga, health and finance workshops, off site social events and discounts to local museums and cultural activities. If this specific job opportunity and the chance to work at a nationally renowned R&D innovation company appeals to you, apply now www.draper.com/careers.

Equal Employment Opportunity

Draper is committed to creating a diverse environment and is proud to be an affirmative action and equal opportunity employer. We understand the value of diversity and its impact on a high-performance culture. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, disability, age, sexual orientation, gender identity, national origin, veteran status, or genetic information.

Draper is committed to providing access, equal opportunity and reasonable accommodation for individuals with disabilities in employment, its services, programs, and activities. To request reasonable accommodation, please contact hr@draper.com.

Responsibilities

The Microsystems Integration Group is seeking subject matter expertise and proven execution capability in high-density die-level electronics packaging. The position requires skills in design, fabrication, and assembly of integrated multi-die electronic systems for research, commercial, and national defense applications. Experience in a research laboratory or industrial environment and excellent communication and analytical skills are required.

A successful applicant will have expertise in electronics packaging technology and the ability to reduce 2.5- and 3-D integration technologies to practice in a low rate production environment. Expertise can include design and process development for electronics and MEMS packaging, wafer-scale electronics integration, thin film systems processing, metallurgy, and microscale metrology. System design and experience on multidisciplinary team including vendors and external technologies is critical.

The candidate should have a background in electrical, mechanical, chemical, and/or materials engineering have demonstrated examples of self-driven efforts in technical areas outside her/ his academic training. The candidate will work in a diverse team-based environment alongside technical staff of varying levels of expertise and should be able to execute technical tasks and communicate technical matters to engineering and management. The ability to work independently and be flexible to the continuously-evolving nature of research and development efforts is essential. This position includes significant on-site and in-lab contributions.

The position may also require proposal writing, business development, and work with external collaborators from government, academia, and industry.

Qualifications
Minimum M.S. or equivalent degree(s) in Materials Science, Mechanical Engineering, or other relevant discipline plus 5-10 years of experience in industry or Ph.D. with relevant experience.* Excellent oral and written communication skills and proficiency with standard workplace and technical software such as Matlab, Python, and/or Labview.* Competency with CAD and physical modeling tools such as Soildworks. This position will require the ability to obtain a US Security Clearance. The primary requirement for a security clearance is US citizenship.

** Draper has implemented a mandatory COVID-19 vaccination requirement for all Draper employees. This will be a condition of employment to work at Draper.

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Job Summary
Company
Start Date
As soon as possible
Employment Term and Type
Regular, Full Time
Required Education
Doctorate
Required Experience
5 to 10 years
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